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PECVD SYSTEMS Plasma-Enhanced Chemical Vapor Deposition (PECVD) is a process used to deposit thin films from a gas or liquid precursor to produce a specific thin film on a substrate. Precipitation of material is initiated by the creation of plasma and is generally RF frequency or DC discharge by electrodes. This electrically active coating area is filled with the reacting precursor. Applications for these processes include three dimensional or conformal coatings.
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