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Sputtering System
 
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Voyager - Flexible PECVD Platform
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The addition of the Voyager to Denton Vacuum's range of deposition platforms provides the thin film specialist with the ability to deposit a variety of films previously difficult to produce due to the geometry of the part or the extended deposition period required. The Voyager utilizes proven hardware configurations developed by Denton Vacuum. The result is a robust mechanical package supported by established controls for ease of operation and intuitive recipe building.

Designed to meet the thin film industry’s requirements for conformal coatings, low temperature processing and high intrinsic uniformity, the Voyager offers Plasma Enhanced Chemical Vapor Deposition on a convenient platform.

Benefits of PECVD processes include an unlimited source of deposition material and the ability to produce defined stresses in the film.

 

Voyager® Brochure (Requires PDF reader)

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Voyager PECVD System
 

Powerful Control System available in semi-manual mode or in fully automatic mode with one push automation to reduce system downtime.

Process Pro Upgrade Offers:

  • Consistent controls across all Denton Vacuum Products
  • Standard software makes it easy to support and avoid costly customization fees
  • Source code for your programs so you can customize your programs.
  • Network capabilities makes the discovery a node on your network enabling real-time, remote support and upgrades.

Convenient Access to Subsystems
Rear or bottom mounted pumps provide easy access for service based on your workspace needs

Multiple Pumping Configurations
A variety of diffusion, cryogenic, and turbo pump configurations are available to fit your budget and process. Rear or bottom fitted pumps provide easy access for service based on your workspace needs.

 

Typical Applications

PECVD

  • Materials Research
  • Small Batch Systems
  • 3D Objects
  • Coat a Variety of Materials

Sputtering

  • Process Development
  • Hard Coatings
  • Amorphous Si
  • Optical Interference Coatings
  • Semiconductor & MEMs Interlayer Dielectric Passivation Layers

Common Deposition Materials

  • TiN
  • SiO2
  • SiN
  • TiO2
  • DLC
 
Options
Sputtering
PECVD
Turbo pump
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RF biased, water cooled substrate stage
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Distributed gas
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Capacitance monometer
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Load lock
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Sputter cathode and power supplies
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Ion source and power supplies
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Alternative gas delivery: vapor source
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Electron beam gun
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Pump Options
Diffusion
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Cryogenic
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Turbo
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Dry scroll
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Oil free
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