Sputtering Systems, Thin Film Coating Systems

System Type

PECVD

PVD

Ion Beam
Etching

Sputtering

System Series

Desk

BTT

DV-502B

Explorer

Voyager

Discovery

Discovery HDG

Discovery Inline

Helios

Integrity

Phoenix

CC-105 Ion Source

SPUTTERING SYSTEMS

Sputtering deposition is a method of depositing thin films by using ions for ejecting material from a target which deposits a thin film onto a substrate commonly using RF, DC or Pulsed DC power sources. Applications for sputtering include scalpels, bone saws, reamers, or any flat substrate.

Desk Series

Desk V Microscopy Sample Preparation Sputtering Tool

Compact benchtop design
For use in R&D and SEM applications
Accepts up to 4" substrates
Vacuum chamber 6" Pyrex or Steel (TSC model)
Automated touch screen controls

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Desktop Pro

High performance Sputtering in a desktop design
Configurable with up to two 2" magnatrons
Accepts up to 6" substrates
Vacuum chamber size 10" dia. x 10" high
Automated touch screen controls

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Bench Top Turbo

Configurable for Sputtering or PVD applications
For use in R&D and sample preparation environments
Accepts up to 6" substrates
Bell jar size up to 12" dia. x 18" high
Automated touch screen controls

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Explorer Series

Configurable for Sputtering, PVD, or PECVD applications
For use in R&D and batch production environments
Accepts up to 10" substrates
Vacuum chamber size 20" x 20" x 20" or Bell Jar up to 12" Dia. x 18" High
Automated touch screen controls or computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

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Voyager Series

Configurable for Sputtering or PECVD applications
For use in R&D and batch production environments
Accepts up to 10" substrates
Vacuum chamber sizes up to 24"
Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

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Discovery Series

Available with load lock substrate transport
For use in R&D and batch production environments
Accepts up to 12" substrates
Vacuum chamber sizes up to 30"
Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

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Phoenix 400
	Available with load lock substrate transport For use in R&D and inline production environments Accepts up to 24" substrates Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software	View Product

Phoenix Series

Phoenix inline production system configurable for sputtering, PVD, PECVD applications

Inline production system configurable for Sputtering, PVD, or PECVD applications
Accepts up to 31" x 61" substrates
Chamber sizes up to 80"
Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

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