Sputtering Systems, Thin Film Coating Systems

System Type

PECVD Systems

Plasma Sterilization

PVD Systems

Sputtering Systems

System Series

Desk

Desktop Pro

BTT

DV-502B

Explorer

Voyager

Discovery

Discovery HDG

Helios

Integrity

Phoenix

CC-105 Ion Source

SPUTTERING SYSTEMS

Sputtering deposition is a method of depositing thin films by using ions for ejecting material from a target which deposits a thin film onto a substrate commonly using RF, DC or Pulsed DC power sources. Applications for sputtering include scalpels, bone saws, reamers, or any flat substrate.

Explorer Series

Configurable for Sputtering, PVD, or PECVD applications
For use in R&D and batch production environments
Accepts up to 10" substrates
Vacuum chamber size 20" x 20" x 20" or Bell Jar up to 12" Dia. x 18" High
Automated touch screen controls or computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

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Voyager Series

Configurable for Sputtering or PECVD applications
For use in R&D and batch production environments
Accepts up to 10" substrates
Vacuum chamber sizes up to 24"
Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

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Discovery Series

Available with load lock substrate transport
For use in R&D and batch production environments
Accepts up to 12" substrates
Vacuum chamber sizes up to 30"
Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

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Phoenix Series

Phoenix inline production system configurable for sputtering, PVD, PECVD applications

Inline production system configurable for Sputtering, PVD, or PECVD applications
Accepts up to 31" x 61" substrates
Chamber sizes up to 80"
Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

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