The Phoenix 400 inline series represents one of Denton Vacuum's offerings for research, pilot-scale as well as continuous production sputtering systems. Utilizing a unique transport system for the substrate carriers, a Phoenix 400 in line system can process multiple substrates and achieve remarkable thickness uniformity and throughput. This arrangement results in smaller footprints and allows the system to be scaled up from research applications to full production requirements. This can significantly lower both the acquisition and operating costs of the delivered system.

Flexible Cathode Configurations
The Phoenix 400 inline system accommodates up to four cathodes and provides for optimized coating uniformity. Each cathode can be configured for a different deposition process and target material for research applications or targets can be operated simultaneously to reduce deposition times. RF, DC, and pulsed DC supplies are available in any combination to meet the desired process requirements.

Substrate Handling
The Phoenix 400 inline system can be designed for research and limited production applications with direct loading of individual substrate carriers or with a load lock magazine and carrier handler for continuous production. Carriers are designed to meet specific throughput or substrate size requirements.

Substrate Preparation
The Phoenix 400 inline system can be designed with substrate heating or a pre-deposition etch. Heating options include quartz lamps or resistive type heat sources optimized for specific temperature requirements. Pre-deposition etch capabilities are designed to meet specific customer requirements - RF, DC, or mid-frequency power options are offered.

Powerful Control System available in semi-manual mode or in fully automatic mode with one push automation to reduce system downtime. Process Pro Upgrade Offers: Consistent controls across all Denton Vacuum Products Standard software makes it easy to support and avoid costly customization fees Source code for your programs so you can customize your programs. Network capabilities makes the discovery a node on your network enabling real-time, remote support and upgrades.

System Pumping Configurations The Phoenix 400 inline system can be delivered with vacuum pumping configurations to fit process or budgetary requirements. Process chambers are typically designed with turbo pumping packages, but cryo pump options are available. Downstream controls are standard for controlling pressure in the process chamber. Load lock chambers are available with turbomolecular, cryogenic, or mechanical pumping options. Non-standard pumping packages available on request. Typical Appications Sputtering Pilot Production Materials Research Continuous Production Optical Coatings Metallization Nanotechnology OLEDs Protective Coatings

Features / Options	Phoenix 400
Maximum substrate up to24" Diameter
Up to four cathodes
RF, DC, Pulsed DC power supplies
Single carrier / manual load
Reactive flow control
Substrate etch
Substrate heat
Pump Configuration
Cryopump with conductance controlling gate valve
Turbomolecular pump with LN2 trap assembly
Two-stage rotary vane mechanical pump
Dry scroll mechanical pump
Turbo or cryo pump in load lock