Denton Vacuum enables innovation.

Denton Vacuum’s Phoenix 400X inline system provides users optimal uniform coating thicknesses and highly homogeneous coatings. As substrates pass linearly, pulled via chain, the flat pallet or carrier is synchronized in its passage among variable separate chambers, from initial intake into atmosphere, through interlocked buffer, to pump-down under sputtering cathodes, emerging though an additional interlocked buffer, and finally out to atmosphere and completion of the run.

Phoenix 400X inline system software provides an automated, synchronized conveyance for challenging layer stacks and simple product mixes. Carriers are configured to accommodate 2 x 3 in substrates. Denton Vacuum’s Phoenix 400 (in-line, continuous or cassette-loaded) series of thin film deposition tools with high vacuum accommodates RF, AC, DC and pulsed DC sputtering for applications in R&D, pilot production, semiconductors, photovoltaics, MEMS and protective coatings. The Phoenix 400 comes equipped with planer cathode and cylindrical cathode configuration. In the planer configuration, the cathodes are variable width and length, flange mounted or dropped in. The cylindrical cathodes are either flange mounted or dropped in, use DC or pulsed DC and are of variable length.

Denton Vacuum tools support the semiconductor industry in “Enabling Innovation” that constantly strives to make chips smaller, faster and more functional, including those for the creation of ultra-thin cap layers and metal gate films in high-k/metal gates for advanced transistors, and in forming ultra-thin barrier materials and seed layers for interconnects, among many other aspects, as highly uniform, conformal deposition of ultra-thin films becomes more challenging in leading-edge devices.

Denton Vacuum helps those focused on in wafer processing, advanced packaging, thin wafer processing, interconnects, MEMS, compound semiconductors, mask etching, and thin film heads—among others—in the ever-emerging semiconductor market.

Application within Semiconductors

  • Amplifiers & Linear
  • Audio
  • Broadband RF/IF
  • Clocks & Timers
  • Compound Semiconductors
  • Data Converters
  • Digital Signal Processing (DSP)
  • DLP & MEMS
  • High-Reliability
  • Interface
  • Isolators
  • Laser Diodes
  • LEDS
  • Logic
  • MEMS
  • Microcontrollers (MCU)
  • Power ICS
  • Power Management
  • Processors
  • Sensors Products
  • Switches & Multiplexers
  • Wireless Connectivity

Processes within Semiconductors

Ion Beam Etch
Ion Beam Etch Systems provide precise definition of complex features.

Denton systems provide high volume metalization to exacting industry standards.

E-Beam Deposition
Denton e-beam deposition systems deposit highly uniform films for power device and compound semiconductor applications.