Denton Vacuum enables innovation.

Denton Vacuum tools support the semiconductor industry in “Enabling Innovation” that constantly strives to make chips smaller, faster and more functional, including those for the creation of ultra-thin cap layers and metal gate films in high-k/metal gates for advanced transistors, and in forming ultra-thin barrier materials and seed layers for interconnects, among many other aspects, as highly uniform, conformal deposition of ultra-thin films becomes more challenging in leading-edge devices.

Denton Vacuum helps those focused on in wafer processing, advanced packaging, thin wafer processing, interconnects, MEMS, compound semiconductors, mask etching, and thin film heads—among others—in the ever-emerging semiconductor market.



Application within Semiconductors

  • Amplifiers & Linear
  • Audio
  • Broadband RF/IF
  • Clocks & Timers
  • Compound Semiconductors
  • Data Converters
  • Digital Signal Processing (DSP)
  • DLP & MEMS
  • High-Reliability
  • Interface
  • Isolators
  • Laser Diodes
  • LEDS
  • Logic
  • MEMS
  • Microcontrollers (MCU)
  • Power ICS
  • Power Management
  • Processors
  • Sensors Products
  • Switches & Multiplexers
  • Wireless Connectivity

Processes within Semiconductors

Ion Beam Etch
Ion Beam Etch Systems provide precise definition of complex features.

Denton systems provide high volume metalization to exacting industry standards.

E-Beam Deposition
Denton e-beam deposition systems deposit highly uniform films for power device and compound semiconductor applications.