Phoenix

A high performance, high output magnetron sputtering system supporting planar and 3D component processing

Used in these Industries

Applications

  • Wafer Metalization
  • 3D Medical Device Coatings
  • AR & Conductive Transparent Coatings
  • Front & Back Contacts for Photovoltaics
  • Composite Dieletric Coatings
  • Discrete & Hybrid Circuit Metalization

Capabilities & Features

  • DC, DC Pulse and RF Magnetron Sputtering
  • 14″ x 14″ (355 mm x 355 mm) Deposition Area
  • RF Bias Preclean
  • Dual-level Load Lock
  • Linear Ion Source Preclean Option
  • Up to Four Linear Cathodes
  • 20″ x 20″ (505 mm x 505 mm) Deposition Area on Phoenix 400X Model

Phoenix® 400X Sputtering System

Phoenix 400X inline system software provides an automated, synchronized conveyance for challenging layer stacks and simple product mixes. Carriers are configured to accommodate 2 x 3 in substrates. Denton Vacuum’s Phoenix 400 (in-line, continuous or cassette-loaded) series of thin film deposition tools with high vacuum accommodates RF, AC, DC and pulsed DC sputtering for applications in R&D, pilot production, semiconductors, photovoltaics, MEMS and protective coatings. The Phoenix 400 comes equipped with planer cathode and cylindrical cathode configuration. In the planer configuration, the cathodes are variable width and length, flange mounted or dropped in. The cylindrical cathodes are either flange mounted or dropped in, use DC or pulsed DC and are of variable length.

Denton Vacuum’s Phoenix 400X inline palletized conveyance system provides users optimal uniform coating thicknesses and highly homogeneous coatings. Denton Vacuum’s Phoenix 400X IPC system is comprised of six distinct stations or chambers, including: intake into atmosphere, dual interlocked pre-process buffer, two-chamber pump-down process, dual interlocked buffer post-process and outtake out to atmosphere.

As substrates pass linearly, pulled via chain, the flat pallet or carrier is synchronized in its passage among these six separate chambers, from initial intake into atmosphere, through interlocked buffer, to pump-down under sputtering cathodes, emerging though an additional interlocked buffer, and finally out to atmosphere and completion of the run.