Infinity Ion Beam Etch Systems
Ion Beam Etch
The newly redesigned Infinity Ion Beam Etch (IBE) wafer etch system delivers high-performance etching, critical thin film profile milling, glancing angle milling and more. It can work equally well for either low-volume R&D or high-volume foundry work. The Infinity IBE can function as a standalone tool, but it is also compatible with all of Denton’s front-end options and in situ controls. For example, the Infinity IBE can be paired with Denton’s Versa cluster platform as part of a fully automated, high-volume manufacturing process, all without breaking vacuum.
Denton Vacuum’s experts will work with you to ensure that your configuration is optimized to meet your exact needs and specifications, and your system will be fully supported by our technical team.
The Infinity IBE is a production-level wafer-etch system, handling wafers up to 200 mm. A highly flexible solution, it is compatible with all Denton’s front-end options. The Infinity IBE is suitable for both low-volume R&D or high-volume foundry work.
How IBE Works
Ion beam etch (IBE) is a physical etch that can etch any material. It can be used to create a specific pattern on the substrate’s surface using masking, and it can also be used to pre-clean a substrate. Similar to other pre-clean methods, IBE completely removes particles from the substrate before deposition; it can also be used to remove a layer from the substrate surface itself to ensure excellent coating uniformity and adhesion. As a pre-cleaning method, IBE features high-energy ions for a high-impact plasma treatment.
IBE is an excellent option for materials and applications that require precise specs for material removal. By using its built-in tilting chuck, it can perform etches at an angle, offering tight process control and repeatability for etching patterns onto a substrate.
Built-in Flexibility
The flexible, versatile Infinity IBE can easily support high-throughput processing for demanding, high-volume applications like pilot production and foundry support for the MEMS, semiconductor, and data storage markets as well as optics and lenses.
The system is class 1000 cleanroom compatible (ballroom style), ESD compliant, and can handle wafers up to 200 mm in size. Chemical assist is available for etch.
The Infinity IBE system features include an industry-leading ion beam source, an optional integrated Secondary Ionization Mass Spectrometer (SIMS) for endpoint detection using the advanced Semiconductor Layer Stop Technology (SLST), automatic layer termination software, and optional fully automatic sample transfer with load lock, enabling high throughput. An optical emissions sensor, which monitors the light the ions emit, is also available as an endpoint option.
Applications
- Semiconductor process yield improvement with end point control
- Compound semiconductor Au etch
- Process control and chip design assessment
- Patterned etch
- Wafer processing service