How They Work
The flexible, versatile PSIBE batch system offers a small footprint that’s perfect for tight production floors. It is designed for low-to-mid throughput applications and is a perfect solution for the MEMS, semiconductor, and data storage markets as well as optics, lenses, pilot production and foundry support.
The Denton’s Vacuum LL (Load Lock) Etch System is a flexible solution designed to support high-throughput processing for demanding, high-volume applications like pilot production and foundry support in the semiconductor, data storage, MEMS, and wafer processing markets.
Both systems are class 1000 cleanroom compatible (ballroom style), ESD compliant and chemical assist is available for etch. LL Etch can be configured for either single chip or multichip and the PSIBE system PSIBE enables cost-effective manual sample transfer with a single wafer load lock.
Both system features include an industry-leading ion beam source, an integrated Secondary Ionization Mass Spectrometer (SIMS) for endpoint detection, advanced Semiconductor Layer Stop Technology (SLST), automatic layer termination software and fully-automatic sample transfer with load lock, enabling a high throughput.
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