See how Denton Vacuum has pioneered thin film for 6 decades.

Infinity Ion Beam Etch Systems

Ion Beam Etch

Load lock etch system

The Infinity PSIBE and the Infinity LL Etch systems delivers high-performance etching, critical thin film profile milling, glancing angle milling and more. Denton Vacuum’s experts will work with you to ensure that your configuration is optimized to meet your exact needs and specifications, and your system will be fully supported by our technical team.


  • Semiconductor process yield improvement with end point control
  • Compound semiconductor Au etch
  • Process control and chip design assessment
  • Patterned etch
  • Wafer processing service

How They Work

The flexible, versatile PSIBE batch system offers a small footprint that’s perfect for tight production floors. It is designed for low-to-mid throughput applications and is a perfect solution for the MEMS, semiconductor, and data storage markets as well as optics, lenses, pilot production and foundry support.

The Denton’s Vacuum LL (Load Lock) Etch System is a flexible solution designed to support high-throughput processing for demanding, high-volume applications like pilot production and foundry support in the semiconductor, data storage, MEMS, and wafer processing markets.

Both systems are class 1000 cleanroom compatible (ballroom style), ESD compliant and chemical assist is available for etch. LL Etch can be configured for either single chip or multichip and the PSIBE system PSIBE enables cost-effective manual sample transfer with a single wafer load lock.

Both system features include an industry-leading ion beam source, an integrated Secondary Ionization Mass Spectrometer (SIMS) for endpoint detection, advanced Semiconductor Layer Stop Technology (SLST), automatic layer termination software and fully-automatic sample transfer with load lock, enabling a high throughput.

Contact Sales View Data Sheet

Learn More