Magnetron sputtering is a highly versatile thin film deposition technique for coating films with excellent adhesion and high density. A type of physical vapor deposition (PVD) coating technology, magnetron sputtering is a plasma-based coating process where a magnetically confined plasma is created near the surface of a target material. Positively charged energetic ions from the plasma collide with the negatively charged target material, and atoms from the target are ejected or “sputtered”, which then deposit on a substrate.
Magnetron sputtering uses a closed magnetic field to trap electrons, increasing the efficiency of the initial ionization process and creating the plasma at lower pressures, reducing both background gas incorporation in the growing film and energy losses in the sputtered atom through gas collisions. Magnetron sputtering is often chosen for the deposition of metallic and insulating coatings that have specific optical or electrical properties.
With Denton’s patented Isoflux inverted cylindrical cathode, the substrate is placed on the inside of the cathode, and it is then sputtered on all sides, from all directions. This configuration offers excellent thickness control and precision, particularly for substrates with curved surfaces, which are used in precision optics. It’s the ideal option for applications where all sides of the substrate need to be coated uniformly, with high repeatability and exacting specs, such as implantable medical devices.