Posted on
For decades, manufacturing production has been moving from the United States to lower-cost countries in Asia and elsewhere. This offshoring has transformed the global economy, for both good and bad. However, investment in U.S.-based manufacturing has recently increased dramatically. Manufacturing capital spending has risen from approximately $82 million per month in 2021 to roughly $224… Read More
Posted on
Semiconductor devices continue to evolve, incorporating increasingly complex architectures, advanced packaging, and multiple materials within a single device. As these technologies become more sophisticated, failure analysis tools must provide precise, repeatable material removal while adapting to a wide range of applications. In this month’s video blog, Denton Vacuum’s Vice President of Marketing and Technology, Dr…. Read More
Posted on
Manufacturers are increasingly seeking to automate as much of the thin film deposition process as possible, working towards a complete “lights out” operation. As a result, manufacturers are moving away from evaporative physical vapor deposition (PVD) methods to using magnetron sputtering. Here’s why. While both evaporation (by thermal resistance or e-beam) and sputtering (either magnetron… Read More
Posted on
Denton strives to create product platforms that can be easily optimized to meet precise customer requirements. With that in mind, Denton has recently re-engineered the Infinity FA whole chip delayering system to be more flexible, reliable, and optimizable. The power of whole chip delayering The Broad ion beam etch (IBE) capabilities of the Infinity FA… Read More
Posted on
Room-temperature deposition on plastic enables creation of a transparent plastic head covering coated with a superconducting thin film, improving on current tin foil hats Breakthrough provides better protection across the entire electro-magnetic spectrum, resulting in clearer thinking unpolluted by outside control MOORESTOWN, NJ – April 1, 2026 – Denton Vacuum LLC, a leading provider of… Read More
Posted on
Denton Vacuum is currently conducting cutting-edge research on how its proprietary ion deposition processes could be used in the manufacturing of quantum computing devices. Denton’s research has the potential to transform the scalability and cost-effectiveness of quantum device production. The Challenge in Building Quantum Devices Building quantum devices demands specialized processes that can deposit ultrapure,… Read More
Posted on
There are many thin film applications that require a patterned coating, such as focal plane arrays with high-density pixels for LiDAR, video imaging and spectrometry. In such applications, a layer of photoresist material is placed on the surface of the wafer, masking the wafer so that only the desired areas are coated through the openings… Read More
Posted on
The grain size of a deposited thin film is directly affected by the method of deposition. While processing parameters such as deposition rate, film thickness, substrate temperature and vacuum pressure all have strong influences on the grain size of the resulting thin film, they are but secondary factors. The deposition method used has a much… Read More
Posted on
The rapid expansion of Artificial Intelligence (AI) and the maturation of quantum computing are placing unprecedented demands on semiconductor manufacturing. As the limits of traditional 2D silicon scaling are reached, the industry is increasingly turning to 3D packaging and Through-Silicon Vias (TSVs) to drive performance. However, these vertical architectures introduce complex manufacturing challenges that standard… Read More
Posted on
The explosion of Artificial Intelligence (AI) and the building of the high-powered data centers that support it has highlighted the potential end of Moore’s Law, a shift that represents an opportunity and a challenge for thin film deposition technologies. The Hidden Problems Behind the Growth of AI To put it plainly, the growth in AI… Read More