Infinity Failure Analysis is for delayering integrated circuits (IC) both at the wafer level and the die level. The Infinity FA uses broad ion beam technology which offers fast large-area layer removal to specific metallization layers in a chip. A secondary ion mass spectrometer (SIMS) is used for ending the etching process at the exact layer of interest.
The Infinity FA System is a cost-effective solution for etching and profiling devices with high throughput, providing rapid results at a low cost of ownership. It delivers excellent delayering uniformity and minimal damage over large areas.