Phoenix

Large Area Coating

PhoenixPhoenix LS and the Phoenix PC are high volume large area systems configured for in-line production to support high throughput for large volume production.

  • The Phoenix LS is based around a rectangular or round linear cathode and supports both planar and 3D component processing. This system can accommodate RF, AC, DC and pulsed DC sputtering processes.
  • The Phoenix PC uses a linear ion source and supports Denton’s tunable Plasma Ion Beam CVD (PIB-CVD) process.

Phoenix Process Options

The Phoenix in-line systems are flexible coating platforms that can be configured with multiple sources to support a variety of applications.

Magnetron sputtering is a highly versatile thin film deposition technique for coating films with excellent adhesion and high density. A type of physical vapor deposition (PVD) coating technology, magnetron sputtering is a plasma-based coating process where a magnetically confined plasma is created near the surface of a target material. Positively charged energetic ions from the plasma collide with the negatively charged target material, and atoms from the target are ejected or “sputtered,” which then deposit on a substrate.

Plasma Ion Beam CVD (PIB-CVD) provides an effective alternative for depositing a variety of thin films at lower temperatures than those used in typical CVD reactors without settling for a lesser film quality.


Phoenix LS – Linear Magnetron for Tight Uniformity

The Phoenix LS uses rectangular or round linear cathodes, also known as planar cathodes.

In a planar cathode configuration, such as that used in the Phoenix LS, the cathode is mounted directly above the substrate. This configuration provides for tight uniformity on one side of the substrate during sputtering for properties such as film thickness, sheet resistance and refractive index. It’s the ideal configuration for applications where co-sputtering is not a requirement. This cathode set-up also offers improved yield, good lift-off capability and a high deposition rate. Rectangular cathodes are most often used with in-line systems such as the Phoenix LS, though round cathodes are available.

Conductive target materials, such as metals, are typically sputtered with DC power supplies. Magnetic materials, such as nickel or iron, are DC sputtered with enhanced magnet packs. Insulating target materials are reactively sputtered with either RF or Pulsed DC power delivery systems.

Phoenix PC – Integrating the Next Generation Chemical Vapor Deposition

The Phoenix PC is based around Denton’s patented linear ion source, which enables a new class of thin film deposition called Plasma Ion Beam CVD (PIB-CVD). This deposition method can be tuned to produce coating compositions ranging from polymer-like to a diamond-like coating (DLC)

The linear ion source behind PIB-CVD allows the ion energies and oxygen ratio to be adjusted to suit the needs of a wide range of applications, not only for flowable, soft, thin film encapsulation layers but also for hard, highly hydrophobic, and optically clear coatings.


PHOENIX LARGE AREA COATING SYSTEMS

Phoenix LS

Phoenix LS

The Phoenix LS magnetron sputtering system offers high throughput for large volume production. It supports both planar and 3D component processing and can accommodate RF, AC, DC, and pulsed DC sputtering processes

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Phoenix PC

Phoenix PC

The Phoenix PC enhanced chemical vapor system also supports high throughput for large volume production. Its use of a linear ion source supports the tunable PIB-CVD process, producing coating compositions ranging from polymer-like to a diamond-like coating (DLC).

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