Application-Specific Configurations

System configurations designed for a particular thin film deposition, etch, or delayering application

The Bosch process creating characteristic surface roughness known as "scalloping"

The “Scallop” Problem: Overcoming the Hidden Thin Film Challenges of the AI and Quantum Revolution

Posted on December 9, 2025December 9, 2025

The rapid expansion of Artificial Intelligence (AI) and the maturation of quantum computing are placing unprecedented demands on semiconductor manufacturing. As the limits of traditional 2D silicon scaling are reached, the industry is increasingly turning to 3D packaging and Through-Silicon Vias (TSVs) to drive performance. However, these vertical architectures introduce complex manufacturing challenges that standard… Read More

The Denton Edge in Thin Films: Designed and Built for Versatility

Posted on October 6, 2025October 6, 2025

In this month’s video, Denton’s Dr. David Douglass, Vice President Marketing and Technology, explains why Denton’s thin film systems are so flexible and easily adapted to suit precise customer needs. Talk to Denton today to see what we can build for you. One of the reasons Denton’s thin film systems are so flexible and easily… Read More

Applications Enhanced by Ion Beam Biased Target Sputtering (BTS)

Posted on March 3, 2025April 4, 2025

While traditional Ion Beam Sputtering (IBS) systems provide good process control, there are drawbacks for certain applications. Denton’s patented Biased Target Sputtering (BTS) can overcome many of the well-known process issues of IBS. In BTS, the low-energy ions generated are below the sputter threshold, and a negative voltage is applied to the target to ensure… Read More

5 Key Considerations for Pre-Cleaning

Posted on November 18, 2024December 3, 2024

In order to achieve the desired properties and meet performance requirements, substrates may need to be pre-cleaned prior to deposition. While there are several methods that can be used to carry out this process, each has its own benefits depending on your pre-cleaning goal and deposition process. For example, RF glow plates use lower energy… Read More

A close up of the Infintiy FA in the Denton Vacuum Customer Application Development Center

The Customer Application Development Center at Denton Vacuum

Posted on September 28, 2023November 26, 2024

Welcome to the Denton Vacuum Applications Laboratory Denton Vacuum has hit a milestone with the Customer Application Development Center, the Apps Lab, as we pass the 10-year mark. The CADC empowers innovation by producing state-of-the-art sputtered, etch, and evaporated thin films and evaluating machine performances with our cutting-edge tools. In the CADC, Denton has three… Read More

Image still of Kyle Godin, a Denton Vacuum engineer

Denton Vacuum Infinity FA Tool

Posted on July 20, 2023November 25, 2024

Enable Uniform Removal of the Entire Layer Regardless of Chemical Composition The Infinity FA from Denton Vacuum is optimized for delayering applications. The Infinity FA can utilize multiple etch technologies for uniform removal of layers. This high-performance etch tool is designed for delayering finished or in-process integrated circuits for failure analysis or reverse engineering. Learn… Read More

Graph showing the average resistivity of two layer W films at the given substrate temperature.

Reducing Resistivity and Stress in Tungsten Coatings

Posted on February 12, 2021November 12, 2024

Tungsten coatings are commonly used in semiconductor applications and have the potential to be used in emerging solar energy applications. These thin films are commonly subject to high stress and low adhesion, but when manufacturers try and compensate for stress, it leads to increased resistivity. In order to achieve the best performance and repeatability for… Read More

Diagram showing a cylindrical cathode configuration with the substrate inside the cathode, sputtering inward.

Benefits of an Inverted Cylindrical Cathode Configuration

Posted on July 22, 2020November 15, 2024

An inverted cylindrical cathode configuration, compared to a planar or confocal configuration, has a few notable benefits because of its highly unique design. Unlike most cathode arrangements, where the cathodes sputter down, up or across the chamber, an inverted cylindrical cathode sputters inward toward the center of the cylinder. This offers several advantages for precision… Read More

Why You Need to Focus on Continuous Improvement for Your Thin Film System

Posted on June 29, 2020November 15, 2024

When investing in thin film deposition equipment, you need to think beyond the short-term results you want to achieve and focus on long-term goals and improvements. Your vendor should have the same focus, as well as the engineering capability to deliver continuous improvement, so you gain reliability, functionality and added value in your system over… Read More

CO2 Laser and Multilayer Coated Reflectors

Thin Film Requirements for EUV Systems

Posted on January 31, 2020November 12, 2024

Extreme ultraviolet (EUV) light requires a very complex process to produce, but this technology has major implications for lithography and nano-machining in semiconductor manufacturing. To ensure performance and precision during manufacturing, components of EUV systems must be produced with high-precision optics and coatings. What is Extreme Ultraviolet Light? Extreme UV light has wavelengths anywhere between… Read More