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Infinity FA Delivers More Flexibility for Advanced Failure Analysis

Posted on July 20, 2026July 17, 2026

Semiconductor devices continue to evolve, incorporating increasingly complex architectures, advanced packaging, and multiple materials within a single device. As these technologies become more sophisticated, failure analysis tools must provide precise, repeatable material removal while adapting to a wide range of applications. In this month’s video blog, Denton Vacuum’s Vice President of Marketing and Technology, Dr…. Read More

A scientist in blue gloves analyzes a computer screen displaying a detailed microchip structure in a high-tech lab setting.

Improving Liftoff with Collimation Control

Posted on February 23, 2026February 13, 2026

There are many thin film applications that require a patterned coating, such as focal plane arrays with high-density pixels for LiDAR, video imaging and spectrometry. In such applications, a layer of photoresist material is placed on the surface of the wafer, masking the wafer so that only the desired areas are coated through the openings… Read More

Gold flakes on a black surface forming a line.

The Impact of Grain Size on Thin Film Performance

Posted on January 6, 2026February 4, 2026

The grain size of a deposited thin film is directly affected by the method of deposition. While processing parameters such as deposition rate, film thickness, substrate temperature and vacuum pressure all have strong influences on the grain size of the resulting thin film, they are but secondary factors. The deposition method used has a much… Read More

Infinity FA Delivers More Flexibility for Advanced Failure Analysis

Improving Liftoff with Collimation Control

The Impact of Grain Size on Thin Film Performance

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