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Real time monitoring of thin film deposition and etch processes using in situ monitoring tools can improve yield and speed production, reducing total cost of ownership (TCO). This is especially true for low-volume, low-yield processes where each finished piece represents a relatively large investment in time, materials, and economic value-add. Denton offers a variety of… Read More
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Semiconductor devices continue to evolve, incorporating increasingly complex architectures, advanced packaging, and multiple materials within a single device. As these technologies become more sophisticated, failure analysis tools must provide precise, repeatable material removal while adapting to a wide range of applications. In this month’s video blog, Denton Vacuum’s Vice President of Marketing and Technology, Dr…. Read More
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There are many thin film applications that require a patterned coating, such as focal plane arrays with high-density pixels for LiDAR, video imaging and spectrometry. In such applications, a layer of photoresist material is placed on the surface of the wafer, masking the wafer so that only the desired areas are coated through the openings… Read More
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The grain size of a deposited thin film is directly affected by the method of deposition. While processing parameters such as deposition rate, film thickness, substrate temperature and vacuum pressure all have strong influences on the grain size of the resulting thin film, they are but secondary factors. The deposition method used has a much… Read More