Thin film deposition, etch, and delayering applications for semiconductor, compound semi, and 3D chips
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There are many thin film applications that require a patterned coating, such as focal plane arrays with high-density pixels for LiDAR, video imaging and spectrometry. In such applications, a layer of photoresist material is placed on the surface of the wafer, masking the wafer so that only the desired areas are coated through the openings… Read More
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The explosion of Artificial Intelligence (AI) and the building of the high-powered data centers that support it has highlighted the potential end of Moore’s Law, a shift that represents an opportunity and a challenge for thin film deposition technologies. The Hidden Problems Behind the Growth of AI To put it plainly, the growth in AI… Read More
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Depositing consistent, high-quality thin films can be challenging. There are any number of factors that can affect yield and performance, but here are the top five challenges in thin film manufacturing: More importantly, there are actionable steps to take in overcoming these challenges in thin film production. Poor Adhesion and Delamination Delamination, where the thin… Read More
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In the intricate world of semiconductor manufacturing, understanding device failures and maintaining consistent quality is more than a technical challenge – it’s a critical business strategy. The smallest of quality issues can snowball to have an outsized impact on yield and profitability. Denton’s Infinity FA system can create automated, repeatable Failure Analysis (FA) and inline… Read More
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As the push for smarter, faster, and more energy-efficient optoelectronic devices intensifies, the role of innovative materials becomes increasingly important. From atomically thin graphene to multifunctional tandem structures, these advanced thin films are enabling breakthroughs in displays, photovoltaics, imaging, sensing and a host of other applications. This article explores some of the most promising materials… Read More
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Many of today’s electronic devices are based not on silicon semiconductors – the mainstay of the computer industry for decades – but on III-V semiconductors, built using specialized alloys with unique properties. However, the inherent cost, brittle nature, and unique characteristics of III-V semiconductors often demand special material handling during the manufacturing process. Denton offers… Read More
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Denton’s Phoenix system platform is designed for high-volume in-line production. The system comes in two primary configurations: the Phoenix LC for magnetron sputtering with a rectangular or rotary linear cathode, and the Phoenix PIB-CVD for room-temperature chemical vapor deposition. Both systems can be configured with multiple sources to support a variety of applications. In this… Read More
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Thin films obtained by standard chemical vapor deposition (CVD) typically require temperatures ranging from 600°C to 800°C. Using plasma enhanced CVD (PE-CVD) allows reactions to occur at temperatures down to 350°C. Plasma ion beam CVD (PIB-CVD) advances this process even further by allowing room temperature deposition. Without the need to heat a substrate to such… Read More
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Conventional failure analysis methods have failed to scale with modern semiconductors, which are larger, more complex, and incorporate a wider variety of materials than ever before. Ion Beam Etch, or IBE, overcomes the challenges that conventional failure analysis methods cannot. IBE provides a uniform etch no matter the material, exposes large areas of interest with… Read More
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In thin films obtained by Chemical Vapor Deposition (CVD), chemical reactions are driven by applying heat to the substrate to be coated or to the area immediately around the substrate. Reactive precursor gasses are then introduced into the deposition chamber and react immediately with the heated substrate surface or combine to form new compounds that… Read More