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The grain size of a deposited thin film is directly affected by the method of deposition. While processing parameters such as deposition rate, film thickness, substrate temperature and vacuum pressure all have strong influences on the grain size of the resulting thin film, they are but secondary factors. The deposition method used has a much… Read More
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The rapid expansion of Artificial Intelligence (AI) and the maturation of quantum computing are placing unprecedented demands on semiconductor manufacturing. As the limits of traditional 2D silicon scaling are reached, the industry is increasingly turning to 3D packaging and Through-Silicon Vias (TSVs) to drive performance. However, these vertical architectures introduce complex manufacturing challenges that standard… Read More
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The explosion of Artificial Intelligence (AI) and the building of the high-powered data centers that support it has highlighted the potential end of Moore’s Law, a shift that represents an opportunity and a challenge for thin film deposition technologies. The Hidden Problems Behind the Growth of AI To put it plainly, the growth in AI… Read More
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With 28 patents and proprietary technologies centered around ion energy and plasma control, Denton Vacuum is uniquely capable of helping semiconductor and nanotech companies deposit low-damage, contamination-free, ultra-thin, and uniform films. In this month’s video, Denton’s Dr. David Douglass, Vice President Marketing and Technology, explains the importance of Denton’s ability to tune plasma ion energy… Read More
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In this month’s video, Denton’s Dr. David Douglass, Vice President Marketing and Technology, explains why Denton’s thin film systems are so flexible and easily adapted to suit precise customer needs. Talk to Denton today to see what we can build for you. One of the reasons Denton’s thin film systems are so flexible and easily… Read More
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Depositing consistent, high-quality thin films can be challenging. There are any number of factors that can affect yield and performance, but here are the top five challenges in thin film manufacturing: More importantly, there are actionable steps to take in overcoming these challenges in thin film production. Poor Adhesion and Delamination Delamination, where the thin… Read More
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Advanced thin films – incorporating innovative materials such as atomically thin graphene – are enabling breakthroughs in displays, photovoltaics, imaging, sensing and a host of other optoelectronic devices. This video focuses on graphene and transition metal dichalcogenides, or TMDs, but Denton’s deposition platforms support development and scalable implementation of not only graphene but also: Graphene… Read More
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Increasingly, fabricators undertaking whole chip delayering are turning to Broad Ion Beam Etching (IBE), which offers significant advantages over more traditional approaches in delayering today’s larger, denser, and more integrated semiconductors. As implemented in Denton’s Infinity FA, Broad IBE provides the necessary uniformity, minimal damage over large areas, and etch rate normalization across different materials… Read More
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In the intricate world of semiconductor manufacturing, understanding device failures and maintaining consistent quality is more than a technical challenge – it’s a critical business strategy. The smallest of quality issues can snowball to have an outsized impact on yield and profitability. Denton’s Infinity FA system can create automated, repeatable Failure Analysis (FA) and inline… Read More
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As the push for smarter, faster, and more energy-efficient optoelectronic devices intensifies, the role of innovative materials becomes increasingly important. From atomically thin graphene to multifunctional tandem structures, these advanced thin films are enabling breakthroughs in displays, photovoltaics, imaging, sensing and a host of other applications. This article explores some of the most promising materials… Read More