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To form indium bumps, a patterned mask is applied to the wafer and then indium is deposited. The patterned mask has “holes” that allow some indium to deposit directly onto the wafer, while the rest of the indium is deposited onto the mask. After indium bump deposition, the unwanted indium and the mask must be… Read More
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An inverted cylindrical cathode configuration, compared to a planar or confocal configuration, has a few notable benefits because of its highly unique design. Unlike most cathode arrangements, where the cathodes sputter down, up or across the chamber, an inverted cylindrical cathode sputters inward toward the center of the cylinder. This offers several advantages for precision… Read More
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When investing in thin film deposition equipment, you need to think beyond the short-term results you want to achieve and focus on long-term goals and improvements. Your vendor should have the same focus, as well as the engineering capability to deliver continuous improvement, so you gain reliability, functionality and added value in your system over… Read More
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Upgrades deliver a number of benefits without the need to invest in brand new equipment. They provide a cost-effective way to lower your cost of ownership, improve process capabilities and reduce maintenance and downtime. The ability to upgrade your thin film deposition configuration depends largely on your specific system, your application and process needs and… Read More
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Precision optics applications require thin film coatings to meet very exacting specs for factors such as refractive index, optical loss, thickness, optical transmission and uniformity. To do this, manufacturers need a full precision optics coating system configured with in-situ control that directly monitors optical properties. Effects on Performance and Yield In precision optics, the acceptable… Read More
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Denton Vacuum was recently assigned patent number 10,573,495 B2 by the U.S. Patent Office for the Endeavor circular ion source. The Endeavor is a filament-free, self-neutralizing ion source that uses a single extraction grid. The Endeavor source is uniquely designed to improve thin film properties and create stress-free, high-density thin films for better performance. With… Read More
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In large-scale, high-volume silicon semiconductor production, such as for microprocessors and DRAM, manufacturers often prefer direct handling of wafers during the thin film deposition process. This makes perfect sense for mass-producing wafers that are all 300mm in size. However, in the compound semiconductor industry, multiple wafer sizes are quite common. It is not economically viable… Read More
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Thin film deposition methods such as evaporation for indium bump deposition are often ideal for achieving good lift-off for patterned coatings. However, evaporation techniques can fall short of production needs for high-volume manufacturing. High-volume applications often require magnetron sputtering as a deposition method. The challenge for these manufacturers is to achieve good lift-off while meeting… Read More
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Laser Focus World recently released their annual report on the laser market, and there are some major industry trends that are expected to impact thin film deposition requirements. Manufacturers who focus on precision and performance for their thin film coatings will be best positioned to take advantage of expected growth. Laser Market Outlook According to… Read More
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Extreme ultraviolet (EUV) light requires a very complex process to produce, but this technology has major implications for lithography and nano-machining in semiconductor manufacturing. To ensure performance and precision during manufacturing, components of EUV systems must be produced with high-precision optics and coatings. What is Extreme Ultraviolet Light? Extreme UV light has wavelengths anywhere between… Read More