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Increasingly, fabricators undertaking whole chip delayering are turning to Broad Ion Beam Etching (IBE), which offers significant advantages over more traditional approaches in delayering today’s larger, denser, and more integrated semiconductors. As implemented in Denton’s Infinity FA, Broad IBE provides the necessary uniformity, minimal damage over large areas, and etch rate normalization across different materials… Read More
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In the intricate world of semiconductor manufacturing, understanding device failures and maintaining consistent quality is more than a technical challenge – it’s a critical business strategy. The smallest of quality issues can snowball to have an outsized impact on yield and profitability. Denton’s Infinity FA system can create automated, repeatable Failure Analysis (FA) and inline… Read More
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As the push for smarter, faster, and more energy-efficient optoelectronic devices intensifies, the role of innovative materials becomes increasingly important. From atomically thin graphene to multifunctional tandem structures, these advanced thin films are enabling breakthroughs in displays, photovoltaics, imaging, sensing and a host of other applications. This article explores some of the most promising materials… Read More
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Denton’s multiple system platforms and its proprietary thin film process technologies enable Denton to deliver unique solutions tailored to customers’ specific applications. In particular, Denton’s proprietary ion energy plasma technologies are uniquely capable of helping semiconductor and nanotech companies produce low-damage, contamination-free, shift-free, ultra-thin and uniform films. Denton’s proprietary ion energy plasma technologies include: Endeavor… Read More
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Many of today’s electronic devices are based not on silicon semiconductors – the mainstay of the computer industry for decades – but on III-V semiconductors, built using specialized alloys with unique properties. However, the inherent cost, brittle nature, and unique characteristics of III-V semiconductors often demand special material handling during the manufacturing process. Denton offers… Read More
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While traditional Ion Beam Sputtering (IBS) systems provide good process control, there are drawbacks for certain applications. Denton’s patented Biased Target Sputtering (BTS) can overcome many of the well-known process issues of IBS. In BTS, the low-energy ions generated are below the sputter threshold, and a negative voltage is applied to the target to ensure… Read More
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Inspired by his work at the Frankford Arsenal in Philadelphia during World War II, Peter Denton established Denton Vacuum with the purpose of being an innovator in thin film deposition technology. Today, Denton is proud to offer state of the art deposition and etch solutions that utilize our proprietary technology. In this video, see the… Read More
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For over half a decade, Denton Vacuum has developed deposition and etch technology that enable users to enhance and innovate their research techniques and manufacturing processes. Discovering ground-breaking technology is not always a straightforward path. It takes a willingness to try, fail, and try again. At Denton, we take pride in our willingness to fail… Read More
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Denton’s Phoenix system platform is designed for high-volume in-line production. The system comes in two primary configurations: the Phoenix LC for magnetron sputtering with a rectangular or rotary linear cathode, and the Phoenix PIB-CVD for room-temperature chemical vapor deposition. Both systems can be configured with multiple sources to support a variety of applications. In this… Read More
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In order to achieve the desired properties and meet performance requirements, substrates may need to be pre-cleaned prior to deposition. While there are several methods that can be used to carry out this process, each has its own benefits depending on your pre-cleaning goal and deposition process. For example, RF glow plates use lower energy… Read More