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Indium bumps are one of the key enabling technologies in superconducting quantum computing, providing superconducting electrical interconnects, low-loss microwave connections, mechanical bonding, and dense 3D integration. In flip-chip bonding of qubit chips, an array of indium bumps bonds a chip containing superconducting qubits face-to-face, with a second chip containing some combination of control wiring, resonators,… Read More
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If you read our earlier publication on the scalability problems of quantum device manufacturing, you know why coating the inside of a through-silicon via (TSV) is so difficult. The etching process leaves behind scalloped sidewalls, yet most modern deposition methods are line-of-sight, making the nearly vertical surfaces an immediate challenge. Inside a quantum device, the… Read More
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Coating a through silicon via’s (TSV’s) interior can push a deposition process to its limits. Material must reach deep into the feature, covering scalloped, nearly vertical sidewalls and delivering consistent film properties throughout the finished device. As developers look to scale superconducting quantum hardware, they add a new dimension to that fundamental challenge. Coverage alone… Read More