Superconducting Via Coatings: The Thin-Film Challenge Behind Quantum Hardware Production
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Coating a through silicon via’s (TSV’s) interior can push a deposition process to its limits. Material must reach deep into the feature, covering scalloped, nearly vertical sidewalls and delivering consistent film properties throughout the finished device. As developers look to scale superconducting quantum hardware, they add a new dimension to that fundamental challenge. Coverage alone… Read More