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Denton strives to create product platforms that can be easily optimized to meet precise customer requirements. With that in mind, Denton has recently re-engineered the Infinity FA whole chip delayering system to be more flexible, reliable, and optimizable. The power of whole chip delayering The Broad ion beam etch (IBE) capabilities of the Infinity FA… Read More
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Room-temperature deposition on plastic enables creation of a transparent plastic head covering coated with a superconducting thin film, improving on current tin foil hats Breakthrough provides better protection across the entire electro-magnetic spectrum, resulting in clearer thinking unpolluted by outside control MOORESTOWN, NJ – April 1, 2026 – Denton Vacuum LLC, a leading provider of… Read More
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Denton Vacuum is currently conducting cutting-edge research on how its proprietary ion deposition processes could be used in the manufacturing of quantum computing devices. Denton’s research has the potential to transform the scalability and cost-effectiveness of quantum device production. The Challenge in Building Quantum Devices Building quantum devices demands specialized processes that can deposit ultrapure,… Read More
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There are many thin film applications that require a patterned coating, such as focal plane arrays with high-density pixels for LiDAR, video imaging and spectrometry. In such applications, a layer of photoresist material is placed on the surface of the wafer, masking the wafer so that only the desired areas are coated through the openings… Read More
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The grain size of a deposited thin film is directly affected by the method of deposition. While processing parameters such as deposition rate, film thickness, substrate temperature and vacuum pressure all have strong influences on the grain size of the resulting thin film, they are but secondary factors. The deposition method used has a much… Read More
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The rapid expansion of Artificial Intelligence (AI) and the maturation of quantum computing are placing unprecedented demands on semiconductor manufacturing. As the limits of traditional 2D silicon scaling are reached, the industry is increasingly turning to 3D packaging and Through-Silicon Vias (TSVs) to drive performance. However, these vertical architectures introduce complex manufacturing challenges that standard… Read More
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The explosion of Artificial Intelligence (AI) and the building of the high-powered data centers that support it has highlighted the potential end of Moore’s Law, a shift that represents an opportunity and a challenge for thin film deposition technologies. The Hidden Problems Behind the Growth of AI To put it plainly, the growth in AI… Read More
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With 28 patents and proprietary technologies centered around ion energy and plasma control, Denton Vacuum is uniquely capable of helping semiconductor and nanotech companies deposit low-damage, contamination-free, ultra-thin, and uniform films. In this month’s video, Denton’s Dr. David Douglass, Vice President Marketing and Technology, explains the importance of Denton’s ability to tune plasma ion energy… Read More
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In this month’s video, Denton’s Dr. David Douglass, Vice President Marketing and Technology, explains why Denton’s thin film systems are so flexible and easily adapted to suit precise customer needs. Talk to Denton today to see what we can build for you. One of the reasons Denton’s thin film systems are so flexible and easily… Read More
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Depositing consistent, high-quality thin films can be challenging. There are any number of factors that can affect yield and performance, but here are the top five challenges in thin film manufacturing: More importantly, there are actionable steps to take in overcoming these challenges in thin film production. Poor Adhesion and Delamination Delamination, where the thin… Read More