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What is Plasma and Why is it Important in Enabling Thin Film Innovation? Plasma is the 4th state of matter after solid, liquid, and gas. Plasma contains a significant portion of charged particles, both ions and electrons. The presence of these charged particles makes plasma distinct from the other fundamental states of matter. Plasma is… Read More
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Inverted cylindrical magnetron (ICM) sputtering is the optimal choice for applications that require ultra-uniform coatings on flat substrates. For example, ICM sputtering offers uniformity below 1% on standard 200mm wafers. ICM sputtering follows the same steps as conventional magnetron sputtering except a cylindrical cathode is used instead of a planar cathode. Instead of sputtering up… Read More
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Forward Thinking There is a need for innovative nano-engineering solutions in the rapidly growing markets of cloud computing, data storage, telecommunications optics, high-power electronics, and sensors for the IoT. Denton’s breadth of technologies and market focus enable advancements ranging from applications in semiconductor failure analysis to production solutions for IR detectors, semiconductor lasers and precision… Read More
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What are Infrared (IR) Bandpass Filters An optical bandpass filter (BPF) is a device that passes wavelengths within a certain range and blocks wavelengths outside that range. One prominent type is infrared (IR) bandpass filters which are used in a wide range of applications including thermal imaging (night vision), emission monitoring for power plants and… Read More
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What is Ion Beam Delayering? Ion beam delayering is the removal of material one layer at a time from a substrate using ion beam etch techniques. The primary objective in the delayering process is to remove material in a manner that exposes the defect location which is buried underneath the layers. As semiconductor device nodes… Read More
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In ion beam etching, a type of dry etching, an ion source is used to remove material from a substrate. This process can be used to create device components and nanostructures, such as in integrated circuits and other semiconductor applications. To enable high yield and meet performance requirements, your application may require different etch technologies…. Read More
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Denton Vacuum was recently assigned U.S. patent number 10,815,570 for a linearized energetic radio-frequency plasma ion source. This source is designed as a large area, filament-free source that is fully compatible with high-throughput, in-line sputtering systems. Some of the unique, patent-protected features of this source are: Benefits of Linear Ion Sources Denton’s linear ion source… Read More
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Ion beam etching (IBE) is a thin film technique that utilizes an ion source to carry out material removal processes on a substrate. IBE is a type of ion beam sputtering and, whether it’s used for pre-clean or patterned etching, it helps ensure excellent adhesion and precise formation of 3D structures. Benefits of Ion Beam… Read More
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As manufacturers look to introduce exciting new features to customers and increase device lifespan in consumer electronics applications, thin film coating requirements are beginning to change as well. Durability and performance continue to be critical but flexibility and ultra-thin coatings are increasingly in demand. Emerging display applications are seeing new form factors and a heavy shift… Read More
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Tungsten coatings are commonly used in semiconductor applications and have the potential to be used in emerging solar energy applications. These thin films are commonly subject to high stress and low adhesion, but when manufacturers try and compensate for stress, it leads to increased resistivity. In order to achieve the best performance and repeatability for… Read More