A thin film deposition technique that utilizes concurrent or periodic bombardment with energetic reactive ions
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If you read our earlier publication on the scalability problems of quantum device manufacturing, you know why coating the inside of a through-silicon via (TSV) is so difficult. The etching process leaves behind scalloped sidewalls, yet most modern deposition methods are line-of-sight, making the nearly vertical surfaces an immediate challenge. Inside a quantum device, the… Read More
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Denton Vacuum is currently conducting cutting-edge research on how its proprietary ion deposition processes could be used in the manufacturing of quantum computing devices. Denton’s research has the potential to transform the scalability and cost-effectiveness of quantum device production. The Challenge in Building Quantum Devices Building quantum devices demands specialized processes that can deposit ultrapure,… Read More
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The rapid expansion of Artificial Intelligence (AI) and the maturation of quantum computing are placing unprecedented demands on semiconductor manufacturing. As the limits of traditional 2D silicon scaling are reached, the industry is increasingly turning to 3D packaging and Through-Silicon Vias (TSVs) to drive performance. However, these vertical architectures introduce complex manufacturing challenges that standard… Read More
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With 28 patents and proprietary technologies centered around ion energy and plasma control, Denton Vacuum is uniquely capable of helping semiconductor and nanotech companies deposit low-damage, contamination-free, ultra-thin, and uniform films. In this month’s video, Denton’s Dr. David Douglass, Vice President Marketing and Technology, explains the importance of Denton’s ability to tune plasma ion energy… Read More
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Increasingly, fabricators undertaking whole chip delayering are turning to Broad Ion Beam Etching (IBE), which offers significant advantages over more traditional approaches in delayering today’s larger, denser, and more integrated semiconductors. As implemented in Denton’s Infinity FA, Broad IBE provides the necessary uniformity, minimal damage over large areas, and etch rate normalization across different materials… Read More
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Denton’s multiple system platforms and its proprietary thin film process technologies enable Denton to deliver unique solutions tailored to customers’ specific applications. In particular, Denton’s proprietary ion energy plasma technologies are uniquely capable of helping semiconductor and nanotech companies produce low-damage, contamination-free, shift-free, ultra-thin and uniform films. Denton’s proprietary ion energy plasma technologies include: Endeavor… Read More
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While traditional Ion Beam Sputtering (IBS) systems provide good process control, there are drawbacks for certain applications. Denton’s patented Biased Target Sputtering (BTS) can overcome many of the well-known process issues of IBS. In BTS, the low-energy ions generated are below the sputter threshold, and a negative voltage is applied to the target to ensure… Read More
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For over half a decade, Denton Vacuum has developed deposition and etch technology that enable users to enhance and innovate their research techniques and manufacturing processes. Discovering ground-breaking technology is not always a straightforward path. It takes a willingness to try, fail, and try again. At Denton, we take pride in our willingness to fail… Read More
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Denton’s Phoenix system platform is designed for high-volume in-line production. The system comes in two primary configurations: the Phoenix LC for magnetron sputtering with a rectangular or rotary linear cathode, and the Phoenix PIB-CVD for room-temperature chemical vapor deposition. Both systems can be configured with multiple sources to support a variety of applications. In this… Read More
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Magnetron sputtering is a plasma-based technique for physical vapor deposition (or PVD) coating that creates dense films with good adhesion. It is excellent for depositing materials with high melting points that cannot be evaporated, and it has the highest scalability of any PVD type. Magnetron sputtering provides excellent precision in film thickness and density of… Read More