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What is Ion Beam Delayering? Ion beam delayering is the removal of material one layer at a time from a substrate using ion beam etch techniques. The primary objective in the delayering process is to remove material in a manner that exposes the defect location which is buried underneath the layers. As semiconductor device nodes… Read More
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In ion beam etching, a type of dry etching, an ion source is used to remove material from a substrate. This process can be used to create device components and nanostructures, such as in integrated circuits and other semiconductor applications. To enable high yield and meet performance requirements, your application may require different etch technologies…. Read More
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Denton Vacuum was recently assigned U.S. patent number 10,815,570 for a linearized energetic radio-frequency plasma ion source. This source is designed as a large area, filament-free source that is fully compatible with high-throughput, in-line sputtering systems. Some of the unique, patent-protected features of this source are: Benefits of Linear Ion Sources Denton’s linear ion source… Read More
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Ion beam etching (IBE) is a thin film technique that utilizes an ion source to carry out material removal processes on a substrate. IBE is a type of ion beam sputtering and, whether it’s used for pre-clean or patterned etching, it helps ensure excellent adhesion and precise formation of 3D structures. Benefits of Ion Beam… Read More
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As manufacturers look to introduce exciting new features to customers and increase device lifespan in consumer electronics applications, thin film coating requirements are beginning to change as well. Durability and performance continue to be critical but flexibility and ultra-thin coatings are increasingly in demand. Emerging display applications are seeing new form factors and a heavy shift… Read More
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Tungsten coatings are commonly used in semiconductor applications and have the potential to be used in emerging solar energy applications. These thin films are commonly subject to high stress and low adhesion, but when manufacturers try and compensate for stress, it leads to increased resistivity. In order to achieve the best performance and repeatability for… Read More
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Spit defects are some of the biggest obstacles to ensuring thickness uniformity and production efficiency in evaporation and indium bump deposition. There are ways to adjust your process to eliminate spit defects and improve yield, but if you work with a partner who has solved for these defects in their system design, you will realize… Read More
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Medical devices often require thin film coatings to optimize performance and longevity, while also ensuring patient safety. Because these devices often feature unique properties compared to “normal” substrates, such as a completely curved or flexible structure, they have challenging thin film deposition process requirements. Magnetron sputtering with an inverted cylindrical cathode is one thin film… Read More
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Material transfer efficiency may not be the biggest concern for all coatings, but when using precious metals, it becomes a major factor in cost of ownership. For applications that require the use of precious metals to ensure performance, like metal contacts and superconducting tape, your thin film deposition system design will play a major role… Read More
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One of the most important requirements for precision optics is thickness uniformity of thin film coatings. Achieving a high degree of uniformity on flat optics usually requires complex motion or restricted deposition zoned, which often lowers deposition rates. For curved optics, there is no practical way to achieve the uniformity needed through a conventional thin… Read More