A physical vapor deposition process that uses ion bombardment to eject material from a target onto a substrate
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Manufacturers are increasingly seeking to automate as much of the thin film deposition process as possible, working towards a complete “lights out” operation. As a result, manufacturers are moving away from evaporative physical vapor deposition (PVD) methods to using magnetron sputtering. Here’s why. While both evaporation (by thermal resistance or e-beam) and sputtering (either magnetron… Read More
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Denton strives to create product platforms that can be easily optimized to meet precise customer requirements. With that in mind, Denton has recently re-engineered the Infinity FA whole chip delayering system to be more flexible, reliable, and optimizable. The power of whole chip delayering The Broad ion beam etch (IBE) capabilities of the Infinity FA… Read More
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Denton Vacuum is currently conducting cutting-edge research on how its proprietary ion deposition processes could be used in the manufacturing of quantum computing devices. Denton’s research has the potential to transform the scalability and cost-effectiveness of quantum device production. The Challenge in Building Quantum Devices Building quantum devices demands specialized processes that can deposit ultrapure,… Read More
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There are many thin film applications that require a patterned coating, such as focal plane arrays with high-density pixels for LiDAR, video imaging and spectrometry. In such applications, a layer of photoresist material is placed on the surface of the wafer, masking the wafer so that only the desired areas are coated through the openings… Read More
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The grain size of a deposited thin film is directly affected by the method of deposition. While processing parameters such as deposition rate, film thickness, substrate temperature and vacuum pressure all have strong influences on the grain size of the resulting thin film, they are but secondary factors. The deposition method used has a much… Read More
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Depositing consistent, high-quality thin films can be challenging. There are any number of factors that can affect yield and performance, but here are the top five challenges in thin film manufacturing: More importantly, there are actionable steps to take in overcoming these challenges in thin film production. Poor Adhesion and Delamination Delamination, where the thin… Read More
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Denton’s multiple system platforms and its proprietary thin film process technologies enable Denton to deliver unique solutions tailored to customers’ specific applications. In particular, Denton’s proprietary ion energy plasma technologies are uniquely capable of helping semiconductor and nanotech companies produce low-damage, contamination-free, shift-free, ultra-thin and uniform films. Denton’s proprietary ion energy plasma technologies include: Endeavor… Read More
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Many of today’s electronic devices are based not on silicon semiconductors – the mainstay of the computer industry for decades – but on III-V semiconductors, built using specialized alloys with unique properties. However, the inherent cost, brittle nature, and unique characteristics of III-V semiconductors often demand special material handling during the manufacturing process. Denton offers… Read More
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For over half a decade, Denton Vacuum has developed deposition and etch technology that enable users to enhance and innovate their research techniques and manufacturing processes. Discovering ground-breaking technology is not always a straightforward path. It takes a willingness to try, fail, and try again. At Denton, we take pride in our willingness to fail… Read More
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Magnetron sputtering is a plasma-based technique for physical vapor deposition (or PVD) coating that creates dense films with good adhesion. It is excellent for depositing materials with high melting points that cannot be evaporated, and it has the highest scalability of any PVD type. Magnetron sputtering provides excellent precision in film thickness and density of… Read More