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The Process Tunability of PIB-CVD Makes it Optimal for Many Thin film Applications. The inherent tunability of PIB-CVD enables a wide range of film properties including flowable, soft, thin film encapsulation layers as well as hard, highly hydrophobic, and optically clear coatings. As a result, multilayer and gradient coatings can be produced in a single chamber from… Read More
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Semiconductor manufacturing often takes a hardware-centric perspective when selecting equipment and vendors. However, manufacturers can benefit from a vendor’s industry experience and, instead, take an application-specific route. A partner like Denton Vacuum, with decades of experience, can address key concerns to get you to production faster than piecing together OEM parts. Working with a single vendor, or… Read More
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Secondary ion mass spectroscopy (SIMS) is a technique for compositional analysis of solid surfaces (such as semiconductors) in which material is removed from a surface by ion beam sputtering and the resultant positive and negative ions are analyzed in a mass spectrometer. This technique can be used to analyze the composition of semiconductor devices and… Read More
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Semicon West 2022 connected business and technology leaders, researchers, and industry analysts from across the microelectronics supply chain in California and online for their annual event. Here are some key takeaways from the conference. Semiconductor Market on Track to a Trillion The semiconductor industry faced several recent challenges and has seen disruptions. A crisis response… Read More
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What is Plasma and Why is it Important in Enabling Thin Film Innovation? Plasma is the 4th state of matter after solid, liquid, and gas. Plasma contains a significant portion of charged particles, both ions and electrons. The presence of these charged particles makes plasma distinct from the other fundamental states of matter. Plasma is… Read More
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Inverted cylindrical magnetron (ICM) sputtering is the optimal choice for applications that require ultra-uniform coatings on flat substrates. For example, ICM sputtering offers uniformity below 1% on standard 200mm wafers. ICM sputtering follows the same steps as conventional magnetron sputtering except a cylindrical cathode is used instead of a planar cathode. Instead of sputtering up… Read More
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Forward Thinking There is a need for innovative nano-engineering solutions in the rapidly growing markets of cloud computing, data storage, telecommunications optics, high-power electronics, and sensors for the IoT. Denton’s breadth of technologies and market focus enable advancements ranging from applications in semiconductor failure analysis to production solutions for IR detectors, semiconductor lasers and precision… Read More
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What are Infrared (IR) Bandpass Filters An optical bandpass filter (BPF) is a device that passes wavelengths within a certain range and blocks wavelengths outside that range. One prominent type is infrared (IR) bandpass filters which are used in a wide range of applications including thermal imaging (night vision), emission monitoring for power plants and… Read More
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What is Ion Beam Delayering? Ion beam delayering is the removal of material one layer at a time from a substrate using ion beam etch techniques. The primary objective in the delayering process is to remove material in a manner that exposes the defect location which is buried underneath the layers. As semiconductor device nodes… Read More
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In ion beam etching, a type of dry etching, an ion source is used to remove material from a substrate. This process can be used to create device components and nanostructures, such as in integrated circuits and other semiconductor applications. To enable high yield and meet performance requirements, your application may require different etch technologies…. Read More