See how Denton Vacuum has pioneered thin film for 6 decades.

Bias Target Sputtering for Thin Film Deposition

Laser reflecting on optic table

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Traditional ion beam sputtering (IBS) provides excellent control over ion energies and thin film stoichiometry, making it the process of choice for sputtering metals and dielectrics for applications such as vanadium oxide microbolometers and VCSELs. Still, IBS has various challenges in meeting the necessary standards for applications in which a high degree of precision and… Read More

Cathode Options for Magnetron Sputtering

Denton Vacuum magnetron sputtering illustration

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Magnetron sputtering is a versatile deposition technique that creates very dense films with good adhesion. It can easily deposit materials with high melting points that cannot be evaporated. Denton Vacuum’s magnetron sputtering systems are highly configurable with multiple cathode options to meet the specific requirements of different applications.  In this article, we discuss the multiple… Read More

Is Evaporation or Sputtering Better for Your Application?

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When selecting a physical vapor technique for your manufacturing process, the end application will greatly affect which technique is best. While PVD has many forms, there are two prominent techniques: evaporation and sputtering. Sputtering through magnetron or ion beam (IBS) utilizes energetic ions colliding with a target to eject (or sputter) target material. Thermal resistive… Read More

How to Prevent Defects in Thin Film Sputtering and Evaporation

Two men in sterile suits

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The goal of any thin film deposition method is to create a high-quality uniform film across the entire surface of a substrate. Unfortunately, defects such as spits, particles, and voids can interfere with your ability to reach desired film quality. If necessary, there are ways to adjust a manufacturing process to eliminate such defects and… Read More

Making a Carbon-Free Future a Reality: Electrolyzers, Platinum, and Thin Film Deposition

PEM electrolysis diagram

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One device helping make the carbon-free future more of a reality is the electrolyzer. Hydrogen is emerging as an increasingly important fuel source, and electrolyzers use electricity to perform electrolysis – the process of dividing water molecules into their separate components of hydrogen gas and oxygen gas. The oxygen and hydrogen can then be compressed… Read More

How Can You Improve Factory Throughput in Thin Film Deposition?

Close up image of a silicon wafer

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Factory throughput in thin film deposition is one of the most critical factors affecting overall production performance. Whether you are manufacturing for high or low volume applications, you need to be able to meet production needs in the most cost-effective way possible, and scale into higher production when needed. Finding ways to raise your factory… Read More

4 Industry Applications for PIB-CVD

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In the world of thin film deposition, there are few techniques that have the versatility of PIB-CVD. Short for plasma ion beam assisted chemical vapor deposition, PIB-CVD is a cutting-edge thin film deposition process that can be used to deposit large area multifunctional thin films with greater efficiency as well as engineer new materials.  What… Read More

Versatile, Turnkey Solutions for Magnetron Sputtering

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Denton offers a number of magnetron configurations to meet different application requirements. Magnetron sputtering is a highly versatile thin film deposition technique for coating films with excellent adhesion and high density. Magnetron sputtering is a plasma-based coating process where a magnetically confined plasma is created near the surface of a target material. Positively charged energetic… Read More

The Benefits of Bias Target Sputtering

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Enabling Sputtering from the Target Only Bias Target Sputtering (BTS) has excellent process control and stoichiometry while reducing contamination and lowering cost of ownership. The ultralow contamination leads to higher performance in lasers and fewer defects enables higher laser damage threshold. BTS is also used for EUV mask blanks which must be defect-free or the… Read More

Denton Receives Patent for Linear Plasma Ion Source

A CAD drawing of Denton Vacuum's patented linear plasma-ion source.

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Denton Vacuum was recently assigned U.S. patent number 10,815,570 for a linearized energetic radio-frequency plasma ion source. This source is designed as a large area, filament-free source that is fully compatible with high-throughput, in-line sputtering systems. Some of the unique, patent-protected features of this source are: Plasma ion source with independent control over ion current… Read More