See how Denton Vacuum has pioneered thin film for 6 decades.

Cathode Options for Magnetron Sputtering

Denton Vacuum magnetron sputtering illustration

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Magnetron sputtering is a versatile deposition technique that creates very dense films with good adhesion. It can easily deposit materials with high melting points that cannot be evaporated. Denton Vacuum’s magnetron sputtering systems are highly configurable with multiple cathode options to meet the specific requirements of different applications.  In this article, we discuss the multiple… Read More

Is Evaporation or Sputtering Better for Your Application?

Robotic arm adding an OLED screen to a smart phone

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When selecting a physical vapor technique for your manufacturing process, the end application will greatly affect which technique is best. While PVD has many forms, there are two prominent techniques: evaporation and sputtering. Sputtering through magnetron or ion beam (IBS) utilizes energetic ions colliding with a target to eject (or sputter) target material. Thermal resistive… Read More

How to Prevent Defects in Thin Film Sputtering and Evaporation

Two men in sterile suits

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The goal of any thin film deposition method is to create a high-quality uniform film across the entire surface of a substrate. Unfortunately, defects such as spits, particles, and voids can interfere with your ability to reach desired film quality. If necessary, there are ways to adjust a manufacturing process to eliminate such defects and… Read More

How Can You Improve Factory Throughput in Thin Film Deposition?

Close up image of a silicon wafer

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Factory throughput in thin film deposition is one of the most critical factors affecting overall production performance. Whether you are manufacturing for high or low volume applications, you need to be able to meet production needs in the most cost-effective way possible, and scale into higher production when needed. Finding ways to raise your factory… Read More

The Customer Application Development Center at Denton Vacuum

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Welcome to the Denton Vacuum Applications Laboratory Denton Vacuum has hit a milestone with the Customer Application Development Center, the Apps Lab, as we pass the 10-year mark. The CADC empowers innovation by producing state-of-the-art sputtered, etch, and evaporated thin films and evaluating machine performances with our cutting-edge tools. In the CADC, Denton has three… Read More

Plasma Ion Beam Chemical Vapor Deposition (PIB-CVD): A New Class of Thin Film Deposition

Interview with Ravindranath Viswan

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PIB-CVD is a groundbreaking thin film deposition technology with a wide range of tunability, scalability, and durability. A primary feature of PIB-CVD is that the ion current density and the ion energy can both be independently controlled without the need for substrate biasing or additional grids. To learn more about the configurations, treatments, and other… Read More

Pre-Cleaning in Thin Film Deposition

Woman in scrubs cleaning a thin film

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The global physical vapor deposition market is expected to expand at a compound annual growth rate (CAGR) of 7.5% from 2022 to 2030. The increasing demand for this process is due to the technological advancements in the industry. PVD films are used in applications for solar cells, optical & electrical components, automobiles, wear coatings, energy… Read More

Managing Spit Defects During Evaporation

A side-by-side comparison of spit during evaporation with a standard source design, and with Denton's proprietary source design. With Denton's design, you see significantly less spit particles.

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Spit defects are some of the biggest obstacles to ensuring thickness uniformity and production efficiency in evaporation and indium bump deposition. There are ways to adjust your process to eliminate spit defects and improve yield, but if you work with a partner who has solved for these defects in their system design, you will realize… Read More

Improving Adhesion During Lift-Off For Indium Bump Deposition

Side-by-side comparison of indium bump arrays without pre-clean and with pre-clean, respectively.

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To form indium bumps, a patterned mask is applied to the wafer and then indium is deposited. The patterned mask has “holes” that allow some indium to deposit directly onto the wafer, while the rest of the indium is deposited onto the mask. After indium bump deposition, the unwanted indium and the mask must be… Read More

4 Design Considerations for Improving Lift-Off Yield

substrate graphic

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While thin film deposition is often used to create a continuous coating on a substrate, there are many applications where a patterned coating is required. These patterns create bumps, trenches or ridges across the surface of the substrate. This coating type is used for 3D applications, such as electrical interconnects. Focal plane arrays with high-density… Read More